An Investigation to determine how much copper can be electroplated under a given condition.

Authors Avatar

Rishul Shah

An Investigation to determine how much copper can be electroplated under a given condition.

Planning

Aim

The aim of this experiment to be carried out as coursework is to investigate how much copper can be electroplated.

Background Knowledge

Electroplating is the process of coating with metal by means of an electric current. When electroplating takes place it makes the metal stronger, this is due to the electrode being made up of the same metal of what is being deposited on the electrode.

Diagram to show the chemical process of electrolysis

A 6 volt battery supplies electric current, which is controlled by a resister. When the circuit is closed, the cathode bar, which holds the work to be plated, is charged negatively. Some of the electrons from the cathode bar transfer to the positively charged copper ions (Cu2+), setting them free as atoms of copper metal. These copper atoms take their place on the cathode surface, copper plating it. An number of sulphate ions (SO4 2-) are discharged on the copper anodes, thereby completing the electrical circuit. In so doing, they form a new quantity of copper sulphate that dissolves in the solution and restores it to its original composition.

If the metal surface of the cathode is chemically and physically clean, the discharged atoms of copper are deposited within normal inter atomic spacing of the atoms of the basis metal and attempt to become an essential part of it. If the basis metal is copper, the new copper atoms will frequently arrange themselves to continue the structure of the basis metal, the plate becoming more or less indistinguishable from and inseparable from the basis metal.

Copper is a chemical element, extremely ductile to metal unusually good conductor of electricity and heat.

The chemical equations for the reactions at the two electrodes:

Anode – Cu(s) – 2e         Cu2+ (aq)

Cathode – Cu2+ + 2e        Cu (s)

Factors Which Effect Electroplating

  • Time – The longer the reaction continues to take place, the larger the mass of copper will be deposited at the cathode. This takes place because the reaction is still continuing, and will carry on until it has finished.

  • Room Temperature – The temperature of the room is dependant. This is because the Ions have more kinetic energy flowing through; therefore the reaction takes place a lot faster.

  • Current – The higher the amount of current going through, the faster the electroplating will take place. This is because the more the electrons present the cathode will start to react in set timing.
Join now!

  • Size of Electrode – The larger the electrode, the more copper is merged into the cathode. This is takes place because there are more copper atoms, which can dissolve in the solution to form Copper Ions (Cu2+). The extra ions can then travel to the cathode and therefore raising the amount of copper ions entering into the cathode.

  • Volume of solution – The greater the volume, the greater the amount of Cu2+ ions will be produced. This takes place because the larger the volume of solution, the greater the area of electrode is merged in the ...

This is a preview of the whole essay